pm-13 high current (fp3) flat-pac? 3 description ? 155c maximum total temperature operation ? low profile high current inductors ? inductance range 0.1uh to 15uh ? design utilizes high temperature powder iron material with a non-organic binder to eliminate thermal aging ? current rating up to 34.7adc (higher peak currents may be attained with a greater rolloff, see rolloff curve) ? frequency range up to 2mhz applications ? computers and portable power devices ? energy storage applications ? dc-dc converters ? input - output filer application en vironmental data ? storage temperature range: -40c to +155c ? operating ambient temperature range: -40c to +155c (range is application specific). ? solder reflow temperature: +260c max. for 10 seconds max. packaging ? units supplied in tape and reel packaging. reel quantity = 1,700 parts per reel. part rated ocl (1) irms (2) isat (3) isat (4) dcr k-factor (5) number inductance h 15% amperes amperes amperes mohms @ 20c h approx. 10% approx. 15% (max.) fp3-r10-r 0.10 0.10 19.0 27 34.7 1.21 803 FP3-R20-R 0.20 0.22 15.3 16 20.8 1.88 482 fp3-r47-r 0.47 0.44 10.9 11.6 14.9 3.67 344 fp3-r68-r 0.68 0.72 9.72 9.0 11.6 4.63 268 fp3-1r0-r 1.00 1.10 6.26 7.4 9.5 11.2 219 fp3-1r5-r 1.50 1.50 5.78 6.2 8.0 13.1 185 fp3-2r0-r 2.00 2.00 5.40 5.4 6.9 15.0 161 fp3-3r3-r 3.30 3.20 3.63 4.3 5.5 30.0 127 fp3-4r7-r 4.70 4.70 3.23 3.5 4.2 40.0 105 fp3-8r2-r 8.20 8.5 2.91 2.6 3.4 74.0 78 fp3-100-r 10.0 10.9 2.30 2.3 3.0 101 69 fp3-150-r 15.0 14.9 2.22 2.0 2.5 127 59 1) ocl (open circuit inductance) test parameters: 100khz, 0.1vrms, 0.0adc 2) dc current for an approximate t of 40c without core loss. derating is neces- sary for ac currents. pcb layout, trace thickness and width, air-flow, and proximi- ty of other heat generating components will affect the temperature rise. it is recommended that the temperature of the part not exceed 155 c under worst case operating conditions verified in the end application. 3) isat amperes peak for approximately 10% rolloff @ 20c 4) isat amperes peak for approximately 15% rolloff @ 20c 5) k-factor: used to determine b p-p for core loss (see graph). b p-p =k*l* i b p-p:(gauss), k: (k factor from table), l: (inductance in uh), i (peak to peak ripple current in amps). flat-pac? 3 low profile inductors mechanical diagrams top view front view 7.50 4.50 (2x) 2.50 (2x) recommended pcb pad layout 2 schematic 1 3.00 max 2.8 0.25 ( 2x) xxx 7.25 max 6.70 max yww 2 2.8 0.25 fp3 (2x) 1 side view 1.0 min. (2x) 4. 0 2. 0 12. 0 a o k o b o 16.0 +/-0. 3 7. 5 1.7 5 a 2 1 a ao= 6.6mm bo= 7.1mm ko= 3.2m m 0.3 rad max. 1.5 dia min. 0.30 +/-0.05 1.5 dia +0.1/-0.0 0.5 rad typ. direction of feed section a-a packaging information dimensions in millimeters xxx = inductance value yww = date code rohs 2002/95/ec
pm-14 high current (fp3) flat-pac? 3 ocl vs. isat 0 10 20 30 40 50 60 70 80 90 100 0 20 40 60 80 100 120 140 160 180 200 % of isat %ofocl fp3 ac loss a fre q uency (khz) tfre q uency, khz coreloss vs. flux density 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 250 500 750 1000 1250 1500 1750 2000 2250 b p-p (gauss) coreloss (w) 200 300 400 500 600 700 800 900 1000 temperature rise vs. watt loss 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 0.12 0.24 0.36 0.48 0.61 0.73 0.85 0.97 1.09 1.21 1.33 1.45 1.57 total loss (w ) temperature rise (c) flat-pac? 3 low profile inductors inductance characteristics core loss
|
